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mpxv5004g rev 7, 05/2005 freescale semiconductor technical data ? freescale semiconductor, in c., 2005. all rights reserved. integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated the mpxv5004g series pi ezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor design ed for a wide range of applications, but particularly those employing a microcontro ller or microprocessor with a/d inputs. this sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. features ? temperature compensated over 10 to 60 c ? available in gauge surface mount (smt) or through-hole (dip) configurations ? durable thermopl astic (pps) package typical applications ? washing machine water level ? ideally suited for mi croprocessor or microcontroller-based systems ordering information (1) 1. mpxv5004g series pressure sensors are av ailable in the basic element package or with a pressure port. two packing opti ons are offered for the surface mount configuration. device type case no. mpxv series order no. packing options device marking through- hole 482b mpxv5004g7u rails mpxv5004g 482c mpxv5004gc7u rails mpxv5004g surface mount 482 mpxv5004g6u rails mpxv5004g 482 mpxv5004g6t1 tape & reel mpxv5004g 482a mpxv5004gc6u rails mpxv5004g 482a mpxv5004gc6t1 tape & reel mpxv5004g 1351 mpxv5004dp trays mpxv5004g 1368 mpxv5004gvp trays mpxv5004g 1369 mpxv5004gp trays mpxv5004g j mpxv5004g series pin numbers (1) 1. pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 n/c 5 n/c 2 v s 6 n/c 3 gnd 7 n/c 4 v out 8 n/c integrated pressure sensor 0 to 3.92 kpa (0 to 400 mm h 2 o) 1.0 to 4.9 v output small outline packages mpxv5004gc7u case 482c-03 mpxv5004g7u case 482b-03 through-hole small outline packages mpxv5004gvp case 1368-01 mpxv5004gp case 1369-01 mpxv5004gc6u case 482a-01 mpxv5004dp case 1351-01 mpxv5004g6u case 482-01 surface mount .com .com .com 4 .com u datasheet
sensors 2 freescale semiconductor mpxv5004g figure 1. fully integrated pressure sensor schematic table 1. maximum ratings (1) 1. exposure beyond the specified limits may c ause permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 16 kpa storage temperature t stg ?30 to +100 c operating temperature t a 0 to +65 c table 2. operating characteristics (v s = 10 v dc , t a = 25c unless otherwise noted, p1 > p2) characteristic symbol min typ max units pressure range p op 0 ? 3.92 400 kpa mm h 2 o supply voltage (1) 1. device is ratiometric within this specified excitation range. v s 4.75 5.0 5.25 v dc supply current i s ? ? 10 madc span at 306 mm h 2 o (3 kpa) (2) 2. span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the mi nimum rated pressure. v fss ? 3.0 ? v offset (3) (4) 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. 4. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relations hip with pressure over the specified pressure range. ? temperature hysteresis:output deviation at any temperature within the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within t he specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? offset stability: output deviation, after 1000 temperature cycles, * 30 to 100 c, and 1.5 million pressure cycles, with minimum rated pressure applied. ? tcspan: output deviation over the temperature range of 10 to 60 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 10 to 60 c, relative to 25 c. ? variation from nominal: the variation from nominal val ues, for offset or full scale span, as a percent of v fss , at 25 c . v off 0.75 1.0 1.25 mv sensitivity v/p ? 1.0 9.8 ? v/kpa mv/mm h 2 o accuracy (5) 5. auto zero at factory installation: due to the sensitivity of the mpxv5004g, external mechani cal stresses and mounting positio n can affect the zero pressure output reading. autozeroing is defined as stori ng the zero pressure output reading and subtracting this from the device's output during normal operations. reference an1636 for specific in formation. the specified accura cy assumes a maximum temperatur e change of 5 c between autozero and measurement. ? ? ? 1.5 2.5 %v fss %v fss v out v s sensing element gnd thin film temperature compensation and calibration circuitry gain stage #2 and ground reference shift circuitry pins 1, 5, 6, 7, and 8 are no connects for small outline package device. .com .com .com .com 4 .com u datasheet
sensors freescale semiconductor 3 mpxv5004g on-chip temperature compensation, ca libration and sig nal conditioning the performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. figure 2 illustrates the gauge configuration in the basic chip carrier (case 482). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. the mpxv5004g series sensor operating characteristics are based on use of dry air as pressure media. media, other than dry air, may have adverse effects on sensor performance and long-term reliability. internal reliability and qualification test for dry air, and other media, are available from the factory. contact the fa ctory for information regarding media tolerance in your application. figure 3 shows the recommended decoupling circuit for interfacing the output of the m pxv5004g to the a/d input of the microprocessor or microcontroller. proper decoupling of the power supply is recommended. figure 4 shows the sensor output signal relative to pressure input. typical, minimum and maximum output curves are shown for operation over a temperature range of 10 c to 60 c using the decoupling circuit shown in figure 3 the output will saturate outside of the specified pressure range. figure 2. cross-sectional diagram (not to scale) figure 3. recommended power supply decoupling and output filtering. (for additional output filterin g, please refer to application note an1646.) figure 4. output versus pressure differential (see note 5 in operating characteristics) fluorosilicone gel die coat wire bond die p1 stainless steel cap thermoplastic case die bond differential sensing element p2 lead frame +5 v 1.0 f 0.01 f 470 pf gnd v s v out ips output 5.0 4.0 2.0 3.0 1.0 max min typical output (v) 2 kpa 200 mm h 2 o 4 kpa 400 mm h 2 o transfer function: v out = v s *[(0.2*p) + 0.2] 1.5% v fss v s = 5.0 v 0.25 vdc temp = 10 to 60 c .com .com .com .com 4 .com u datasheet
sensors 4 freescale semiconductor mpxv5004g pressure (p1)/vacuum (p2) side identification table freescale semiconductor desi gnates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing silicone gel which isolates the die from the environment. the freescale semiconductor pressure sensor is designed to operate with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below. information for using the small outline package (case 482) minimum recommended footprint for surface mounted applications surface mount board la yout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. with the correct footprint, the packages will se lf align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. figure 5. sop footprint (case 482) part number case type pressure (p1) side identifier mpxv5004gc6u/t1 482a side with port attached mpxv5004g6u/t1 482 stainless steel cap mpxv5004gc7u 482c side with port attached mpxv5004g7u 482b stainless steel cap mpxv5004gp 1369 side with port attached mpxv5004dp 1351 side with port marking mpxv5004gvp 1368 stainless steel cap 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 8x 2.54 0.300 7.62 inch mm scale 2:1 .com .com .com .com 4 .com u datasheet
sensors freescale semiconductor 5 mpxv5004g package dimensions s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a s t -a- -b- n c m j k pin 1 identifier h seating plane -t- dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 5.38 0.230 0.212 5.84 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.405 0.415 10.29 10.54 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. case 482-01 issue o small outline package surface mount pin 1 identifier h seating plane -t- w c m j k v dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a t -a- -b- n s case 482a-01 issue a small outline package surface mount .com .com .com .com 4 .com u datasheet
sensors 6 freescale semiconductor mpxv5004g package dimensions millimeters inches 0.100 bsc 2.54 bsc dim a b c d g j k m n s min 0.415 0.415 0.210 0.026 0.009 0.100 0? 0.405 0.540 max 0.425 0.425 0.220 0.034 0.011 0.120 15? 0.415 0.560 min 10.54 10.54 5.33 0.66 0.23 2.54 0? 10.29 13.72 max 10.79 10.79 5.59 0.864 0.28 3.05 15? 10.54 14.22 pin 1 identifier k seating plane -t- detail x s g 4 5 8 1 -a- -b- c m j n d 8 pl s b m 0.25 (0.010) a s t detail x notes: 1. 2. 3. 4. 5. 6. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension a and b do not include mold protrusion. maximum mold protrusion 0.15 (0.006). all vertical surfaces 5? typical draft. dimension s to center of lead when formed parallel. case 482b-03 issue b small outline package through-hole millimeters inches 0.100 bsc 2.54 bsc dim a b c d g j k m n s v w min 0.415 0.415 0.500 0.026 0.009 0.100 0? 0.444 0.540 0.245 0.115 max 0.425 0.425 0.520 0.034 0.011 0.120 15? 0.448 0.560 0.255 0.125 min 10.54 10.54 12.70 0.66 0.23 2.54 0? 11.28 13.72 6.22 2.92 max 10.79 10.79 13.21 0.864 0.28 3.05 15? 11.38 14.22 6.48 3.17 pin 1 identifier k seating plane -t- w detail x s g 4 5 8 1 -a- -b- n c v m j d 8 pl s b m 0.25 (0.010) a s t detail x notes: 1. 2. 3. 4. 5. 6. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. dimension a and b do not include mold protrusion. maximum mold protrusion 0.15 (0.006). all vertical surfaces 5? typical draft. dimension s to center of lead when formed parallel. case 482c-03 issue b small outline package through-hole .com .com .com .com 4 .com u datasheet
sensors freescale semiconductor 7 mpxv5004g package dimensions case 1351-01 issue o small outline package surface mount notes: 1. 2. 3. 4. controlling dimension: inch. interpret dimensions and tolerances per asme y14.5m, 1994. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.008 (0.203) maximum. n a c 0.004 (0.1) detail g seating plane 8x p d e e/2 e a m 0.004 (0.1) b c e1 a b a 0.006 (0.15) b c 8x b 2 places 4 tips 1 4 8 5 f min max min max millimeters inches 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0.100 bsc 2.54 bsc 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0? 7? 0? 7? dim a a1 b d e e1 e m n p t f k l k m t ? gage plane detail g l a1 .014 (0.35) style 1: pin 1. gnd 2. +vout 3. vs 4. -vout 5. n/c 6. n/c 7. n/c 8. n/c style 2: pin 1. n/c 2. vs 3. gnd 4. vout 5. n/c 6. n/c 7. n/c 8. n/c .com .com .com .com 4 .com u datasheet
sensors 8 freescale semiconductor mpxv5004g package dimensions case 1368-01 issue o small outline package surface mount n a c 0.004 (0.1) detail g seating plane 8x p t ? d e e/2 e a m 0.004 (0.1) b c e1 a b a 0.006 (0.15) b c 8x b 2 places 4 tips 1 4 8 5 f notes: 1. controlling dimension: inch. 2. interpret dimensions and tolerances per asme y14.5m-1994. 3. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. 4. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.008 (0.203) maximum. inches 0.100 bsc dim a a1 b d e e1 e m n p r f k l t min 0.280 0.002 0.038 0.465 0.465 0.035 0.075 0.009 0.405 0.240 0.115 0.040 0? 0.110 max 0.300 0.010 0.042 0.485 0.485 0.055 0.095 0.011 0.415 0.260 0.135 0.060 7? 0.130 min 7.11 0.05 0.96 11.81 11.81 1.90 0.89 0.23 10.28 6.10 2.92 1.02 0? 2.79 max 7.62 0.25 1.07 12.32 12.32 2.41 1.39 0.28 10.54 6.60 3.43 1.52 7? 3.30 0.690 bsc millimeters 2.54 bsc 17.52 bsc k m r ? gage plane detail g l a1 .014 (0.35) style 1: pin 1. gnd 2. +vout 3. vs 4. -vout 5. n/c 6. n/c 7. n/c 8. n/c style 2: pin 1. n/c 2. vs 3. gnd 4. vout 5. n/c 6. n/c 7. n/c 8. n/c .com .com .com .com 4 .com u datasheet
sensors freescale semiconductor 9 mpxv5004g package dimensions notes: 1. 2. 3. 4. controlling dimension: inch. interpret dimensions and tolerances per asme y14.5m, 1994. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.008 (0.203) maximum. n a c 0.004 (0.1) detail g seating plane 8x p t ? d e e/2 e a m 0.004 (0.1) b c e1 a b a 0.008 (0.20) b c 8x b 2 places 4 tips 1 4 8 5 f dim min max min max millimeters inches a 0.300 0.330 7.11 7.62 a1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 d 0.465 0.485 11.81 12.32 e e1 0.465 0.485 11.81 12.32 e m 0.270 0.290 6.86 7.36 n 0.080 0.090 2.03 2.28 p 0.009 0.011 0.23 0.28 t 0.115 0.125 2.92 3.17 0.100 bsc 2.54 bsc f 0.245 0.255 6.22 6.47 k 0.120 0.130 3.05 3.30 l 0.061 0.071 1.55 1.80 0? 7? 0? 7? 0.717 bsc 18.21 bsc k m gage plane detail g l a1 .014 (0.35) case 1369-01 issue o small outline package surface mount .com .com .com .com 4 .com u datasheet
sensors 10 freescale semiconductor mpxv5004g notes .com .com .com .com 4 .com u datasheet
sensors freescale semiconductor 11 mpxv5004g notes .com .com .com .com 4 .com u datasheet
how to reach us: home page: www.freescale.com e-mail: support@freescale.com usa/europe or locations not listed: freescale semiconductor technical information center, ch370 1300 n. alma school road chandler, arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) support@freescale.com japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com mpxv5004g rev. 7 05/2005 information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2005. all rights reserved. .com .com .com 4 .com u datasheet

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